Form：Linghua Technology 2017/8/10Browse：3367
ADLINK is committed to promoting cross-industry data decision-making applications, as the world's leading provider of edge computing solutions, today announced the new media cloud server MCS-2080, a dedicated high-density platform, in 2U space can support Up to 16 Intel Xeon E3-1585 v5 processors.
Form：Synopsys 2017/8/9Browse：3695
Synopsys today introduced the complete DesignWare High-Bandwidth Memory 2 (HBM2) IP solution, which includes controllers, PHYs and authentication IPs, enabling an aggregate bandwidth of 307 GB / s and a DDR4 interface at 3200 Mb / s data transfer rate operation under 12 times.
Form：Marvell 2017/8/9Browse：3671
Marvell Mavell (NASDAQ: MRVL), the world's leading provider of storage, cloud and networking, today announced the industry's first Gigabit Ethernet switch to provide higher connectivity for next-generation interconnects Level of secure data transmission
Form：Microsemi Corporation 2017/8/9Browse：3779
Microsemi Corporation, a leading provider of differentiated semiconductor technology solutions for power, security, reliability and performance, today announced that its Switchtec PAX network interconnects Gen3 PCIe switching chips to provide high-performance network connectivity , For scalable multi-host systems and Just a bunch of flash (JBOF), and supports single input / output (I / O) virtualization (SR-IOV), NVMe, and multifunction endpoints.
Form：Vishay 2017/8/8Browse：4594
Vishay Intertechnology, Inc. today announced the industry's first surface-mount multilayer ceramic chip capacitors (MLCC) for high frequency RF and microwave applications - the VitramonVJ HIFREQ HT series with operating temperature range of +200 ° C
Form：Littelfuse 2017/8/8Browse：3844
Littelfuse, Inc., a global leader in circuit protection, today introduced a compact surface mount polymer automotive-grade electrostatic discharge suppressor that protects sensitive equipment from hazards of up to 30kV of contact discharge / air discharge.
Form：Renesas Electronics 2017/8/8Browse：3958
Raisar Electronics, Inc., the world's leading provider of semiconductor solutions, today announced that it has begun massaging its first R-Car system-on-chip (SoC) system using automotive-grade Linux (AGL) software.
Form：Bourns 2017/8/7Browse：3614
Bourns, a leading global supplier of electronic components, announced the addition of a new force to its award-winning Multifuse products - AEC-Q200 certified high temperature polymer polymer positive temperature coefficient (PPTC) self-healing fuse.
Form：GLOBALFOUNDRIES 2017/6/19Browse：5310
GLOBALFOUNDRIES announces the introduction of its FX-7 ™ ASIC (Application Specific Integrated Circuits) using a 7nm FinFET process. The FX-7 is an integrated design platform that combines state-of-the-art process technology with differentiated intellectual property rights and 2.5D / 3D packaging technology to deliver the industry's most complete portfolio of data centers, machine learning, automotive, wireline communications and 5G wireless applications s solution.
Form：Maxim 2017/6/19Browse：4988
Maxim announced the MAX20078 Synchronous Buck, High Brightness LED Controller, the industry's only component that provides both fast response time and low EMI (EMI) for external LED lighting and improved safety applications. The LED controller can be used for matrix lighting design, providing designers with high-performance, simple design, and can quickly market solutions.
